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Dynacraft manufactures QFP lead frames in many configurations. A
wide variety of open tools are available in matrix formats.
Internal lead pitch is minimized to shorten gold wire length. Some
frames have epoxy locks around the die-attach pad for enhanced
QFP lead frame can be produce by etching to achieve fine pitch,
we are capable of 150 micron inner lead pitch for 5 mil material
and with very tight Silver plating thickness range of 100 micro
inch. Bakend tooling process has capability on deep downset from
2.8X to 5.8X of material thickness and taping with 4 sided segment
tapes for single, dual and three row format.