We created a Personal Account for you to make the process of buying faster and easier in the future.To activate, use the link in the E-mail that we have sent to you
Dynacraft manufactures QFP lead frames in many configurations. A wide variety of open tools are available in matrix formats. Internal lead pitch is minimized to shorten gold wire length. Some frames have epoxy locks around the die-attach pad for enhanced package reliability.
QFP lead frame can be produce by etching to achieve fine pitch, we are capable of 150 micron inner lead pitch for 5 mil material and with very tight Silver plating thickness range of 100 micro inch. Bakend tooling process has capability on deep downset from 2.8X to 5.8X of material thickness and taping with 4 sided segment tapes for single, dual and three row format.